Intrinsyc’s compact “Open-Q 605” SBC for computer vision and edge AI applications runs Android 8.1 and Qualcomm’s Vision Intelligence Platform on Qualcomm’s IoT-focused, octa-core QCS605.
In April, Qualcomm announced its QCS605 SoC, calling it “the first 10nm FinFET fabricated SoC purpose built for the Internet of Things.” The octa-core Arm SoC is available in an Intrinsyc Open-Q 605 SBC with full development kit with a 12V power supply is open for pre-orders at $429. The products will ship in early December.
Open-Q 605, front and back
The fact that Qualcomm is billing the high-end QCS605 as an IoT SoC reveals how demand for vision and AI processing on the edge is broadening the IoT definition to encompass a much higher range of embedded technology. The IoT focus is also reinforced by the lack of the usual Snapdragon branding. The QCS605 is accompanied by the Qualcomm Vision Intelligence Platform, a set of mostly software components that includes the Qualcomm Neural Processing SDK and camera processing software, as well as the company’s 802.11ac WiFi and Bluetooth connectivity and security technologies.
The QCS605 supports Linux and Android, but Intrinsyc supports its Open-Q 605 board only with Android 8.1.
Qualcomm QCS605 and Vision Intelligence Platform
The QCS605 SoC features 8x Kryo 300 CPU cores, two of which are 2.5GHz “gold” cores that are equivalent to Cortex-A75. The other six are 1.7GHz “silver” cores like the Cortex-A55 — Arm’s more powerful follow-on to Cortex-A53.
The QCS605 also integrates an Adreno 615 GPU, a Hexagon 685 DSP with Hexagon vector extensions (“HVX”), and a Spectra 270 ISP that supports dual 16-megapixel image sensors. Qualcomm also sells a QCS603 model that is identical except that it offers only 2x of the 1.7GHz “Silver” cores instead of six.
Qualcomm sells the QCS605 as part of a Vision Intelligence Platform — a combination of software and hardware starting with a Qualcomm AI Engine built around the Qualcomm Snapdragon Neural Processing Engine (NPE) software framework. The NPE provides analysis, optimization, and debugging tools for developing with Tensorflow, Caffe, and Caffe2 frameworks. The AI Engine also includes the Open Neural Network Exchange interchange format, the Android Neural Networks API, and the Qualcomm Hexagon Neural Network library, which together enable the porting of trained networks.
The Vision Intelligence Platform running on the QCS605 delivers up to 2.1 TOPS of compute performance for deep neural network inferences, claims Qualcomm. The platform also supports up to 4K60 resolution or 5.7K at 30fps and supports multiple concurrent video streams at lower resolutions.
Other features include “staggered” HDR to prevent ghost effects in high-dynamic range video. You also get advanced electronic image stabilization, de-warp, de-noise, chromatic aberration correction, and motion compensated temporal filters in hardware.
Inside the Open-Q 605 SBC
Along with the Snapdragon 600 based Open-Q 600, the Open-Q 605 is the only Open-Q development board that Intrinsyc refers to as an SBC. Most Open-Q kits are compute modules or sandwich-style carrier board starter kits based on Intrinsyc modules equipped with Snapdragon SoCs, such as the recent, Snapdragon 670 based Open-Q 670 HDK.
Open-Q 605
The 68 x 50mm Open-Q 605 ships with an eMCP package with 4GB LPDDR4x RAM and 32GB eMMC flash, and additional storage is available via a microSD slot. Networking depends on the 802.11ac (WiFi 5) and Bluetooth 5.x radios. There’s also a Qualcomm GNSS receiver for location and 3x U.FL connectors.
The only real-world coastline port is a USB Type-C that supports DisplayPort 1.4 with [email protected] support. If you’d rather use the Type-C port for USB or charging a user-supplied Li-Ion battery, you can turn to an HD-ready MIPI DSI interface with touch support. You also get 2x MIPI-CSI for dual cameras, as well as 2x analog audio.
The Open-Q 605 has a 76-pin expansion header for other interfaces, including an I2S/SLIMBus digital audio interface. The board runs on a 5-15V DC input and offers an extended -25 to 60°C operating range.
Specifications listed for the Open-Q 605 SBC include:
- Processor — Qualcomm QCS605 with Vision Intelligence Platform (2x up to 2.5GHz and 6x up to 1.7GHz Krait 300 cores); Adreno 615 GPU; Hexagon 685 DSP; Spectra 270 ISP; Qualcomm AI Engine and other VIP components
- Memory/storage — 4GB LPDDR4X and 32GB eMMC flash in combo eMCP package; microSD slot.
- Wireless:
- 802.11b/g/n/ac 2×2 dual-band WiFi (Qualcomm WCN3990) with planned FCC/IC/CE certification
- Bluetooth 5.x
- Qualcomm GNSS (SDR660G) receiver with Qualcomm Location Suite Gen9 VT
- U.FL antenna connectors for WiFi, BT, GNSS
- Media I/O:
- DisplayPort 1.4 via USB Type-C up to with USB data concurrency (USB and power)
- MIPI DSI (4-lane) with I2C touch interface on flex cable connector for up to 1080p30
- 2x MIPI-CSI (4-lane) with micro-camera module connectors
- 2x analog mic I/Ps, speaker O/P, headset I/O
- I2S/SLIMBus digital audio interface with 2x DMIC ports (via 76-pin expansion header)
- Expansion — 76-pin header (multiple SPI, I2C, UART, GPIO, and sensor I/O; digital and analog audio I/O, LED flash O/P, haptic O/P, power output rails
- Other features — 3x LEDs; 4x mounting holes; optional dev kit with quick start guide, docs, SW updates
- Operating temperature — -25 to 60°C
- Power — 5-15V DC jack and support for user-supplied Li-Ion battery with USB Type-C charging; PM670 + PM670L PMIC; 12V supply with dev kit
- Dimensions — 68 x 50 x 13mm
- Operating system — Android 8.1 Oreo
Further information
The Open-Q 605 SBC is available for pre-order in the full Development Kit version, which costs $429 and ships in early December. The SBC will also be sold on its own at an undisclosed price. More information may be found in Intrinsyc’s Open-Q 605 announcement, as well as the product page and shopping page.